JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. EIAJ EDA – Read more about eiaj, jeita and EIAJ ED ꞉ (EN) Enviado por Selvakpm Direitos autorais: © All Rights Reserved. Baixe no formato PDF ou leia online no Scribd.
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About the devices for evaluation and the test method There are two types of specimen that are used for the evaluation specified in the standard. The acceleration characteristic on ieaj market can be calculated using equation 4. Mechanical stress test methods for eisj surface mounting devices. According to Table 1, the specimen shall be tested starting at low temperature. These temperatures adopted by car manufacturers ieaj additionally noted as one of the test conditions.
Test temperature and time are 12 Thermal t1 to be as stipulated by individual Shock specification. Even the same specified amount of deflection is applied, the stress on joint in the case of span 50 mm is not the same stress in the case of span 90 mm, because of the ejaj of curvature of PCB is not the same. In the first mentioned case, actual devices are measured. Atsushi Natsume Sony Corp.
And to check out limit ed-44702, it is discussed that to measure electrical characteristics while changing amount of deflections. Including those amenable to surface mount by forming. Environmental and endurance test methods for semiconductor devices Stress test I The list below shows why the test conditions described in Test method were so specified.
Non-destructive recognition procedures of defects in Silicon Carbide Wafers Part 2: Example, too many times and a few mistaking between the newest version and old version. However, note that the boundary-scan test method is applicable only to the semiconductor devices corresponding to that test method.
As per individual specification.
Sharp-Reliability Test Standard for IC_图文_百度文库
Under these circumstances, the standardization of the reliability evaluation methods for the soldering joint on the board and the semiconductor devices being mounted on that board, elaj actual operating environments after the semiconductor packages have been mounted on the board, is required.
A Shape of Shock Wave? However, because the test method is not reality and needs the test board meets to package dimension in SMD case, this standard did not provide. So, the standard has adopted equation 4 for the accelerated characteristic.
In particular, utmost attention should be paid to the precautions indicated in the detail specifications. And its results ejaj depend on the assembly conditions between euaj enclosure and the motherboard. However, it is used in the standard to simply and clearly describe the type of the package outline subject to the standard. Quality Assurance Guidelines for Bare Die.
3-3 Standards Related to Reliability Test ｜Sanken Electric
As a reference, Table1 shows the result of the calculation of the acceleration characteristic of both the test conditions and the typical conditions on the market. Kohki Ohara Ricoh Co.
F Continuously 3 times for Breakage o. Or up to Condition Solder Temp. Figure 1 shows an example of method 1. Environmental and endurance test methods for semiconductor devices Stress test II.
Under the temperature cycling test conditions shown in Table 1, a majority said that there was correlation with the assumed conditions in the market; therefore, the acceleration equation was employed. SCOPE Push strength test for soldering joint This standard provides for endurance test methods to evaluate the endurance of push strength fixedness between SMD and printed wiring board at SMD mounted board against mechanical stress is applied from side direction in some external mechanical stress.
Replace at an initial position with the same speed. JEITA assumes absolutely no responsibility toward parties applying these standards or toward patent owners. Temperature cycle after mounting Test Method The temperature of the air at a place separated by a distance sufficient to neglect the influence of the heat radiation from the specimen, when it is cooled by natural convection.
Pitch Applied strength 0. However, the TEG is used for partial evaluation only, and it is not appropriate that it is used to find out either the synergy of or the effect on the actual devices or the failures caused by mismatching.
F See below Surface Temp. It also largely depends on the method of board process. Also, this standard did not provide the test method that cut leads of one side of SMD and deform the cut leads to vertical direction against printed wiring board, because this test is not reality.
The pre-treatment, equivalent to the humidity absorption which occurs during the storage period until the actual mounting by soldering, which the specimens are submitted to before the soldering process.
Therefore, there are two kinds of the copper wiring thickness of type B in the table. Ed-47022 this test, the printed circuit board, solderability, and the SMD may cause complex effects.